SOLDERING DEVICE AND PRINTED-WIRING BOARD HOLDER

摘要

PROBLEM TO BE SOLVED: To prevent a crack and a peeling to soldering sections for electronic parts soldered at the first time in the case of the second flow method when one surface is soldered by a reflow method and another surface by the flow method in a printed-wiring board in which the electronic parts are mounted on both surfaces. SOLUTION: The width of a conveyor 1 is changed in response to the thermal expansion and contraction of the printed-wiring board 7 by the elastic deformation of elastic shafts 4 secured on a soldering device. COPYRIGHT: (C)2003,JPO