| 摘要 |
PROBLEM TO BE SOLVED: To downsize a solid-state image pickup device. SOLUTION: A solid-state image pickup element (CCD, CMOS, etc.), 13 and a DSP (digital signal processor) 14 are directly stuck together, the DSP 14 is provided on the substrate 14 for a camera by flip-chip mounting, and the solid-state image pickup element 13 on the rear surface of the DSP 14 is mounted over the substrate 14 for a camera by wire bonding. The substrate 4 for a camera is provided with a through hole part 4a, and the solid-state image pickup element 13 is located inside the through hole part 4a. COPYRIGHT: (C)2003,JPO
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