| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing an optical semiconductor device and a semiconductor unit by which generation of cracks penetrating a translucent member from its main face to its side face is prevented, the optical semiconductor device is airtightly housed within the semiconductor package, a long-term normal and stable operations are secured and a light signal is efficiently transmitted. SOLUTION: The package for housing the optical semiconductor device and the semiconductor unit comprise a substrate 1 wherein the optical semiconductor device 8 is placed on an upper side main face, a frame 2 that is joined with an outer periphery of the upper side main face and has a through hole 2a at the side portion, a cylindrical retaining member 5 fitted to the through hole 2a and the plate type translucent member 4 of which outer periphery of one main face is retained by brazing to one end of an inner side of the frame 2 of the retaining member 5, wherein the translucent member 4 is brazed via a metalized layer 4a formed almost over the total outer periphery of one main face and a groove 4b of which width is smaller than that of the metalized layer 4a is formed almost over the total periphery within such part where the metalized layer 4a of one main face is formed. COPYRIGHT: (C)2003,JPO
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