发明名称 |
Method of applying a bottom surface protective coating to a wafer, and wafer dicing method |
摘要 |
The present invention provides a new backside treatment of the wafer. Trenches are cut into the top surface of the wafer by sawing or etching, and after grinding the wafer from the bottom side, a protective material is applied as a surface layer to the bottom surface while filling the trenches with this material. The material is hardened in order to accomplish the sawing process. In another embodiment of the present method, a double foil layer is applied to the rear side of the wafer including a mounting tape and a protective layer facing the wafer rear side.
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申请公布号 |
US2003143818(A1) |
申请公布日期 |
2003.07.31 |
申请号 |
US20020062942 |
申请日期 |
2002.01.31 |
申请人 |
VASQUEZ BARBARA;WALLIS DAVID;WINTER SYLVIA |
发明人 |
VASQUEZ BARBARA;WALLIS DAVID;WINTER SYLVIA |
分类号 |
H01L21/301;H01L21/304;H01L21/68;H01L21/78;(IPC1-7):H01L21/301;H01L21/46 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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