| 摘要 |
PROBLEM TO BE SOLVED: To improve the performance of a wiring board, and to reduce the manufacturing cost of an electronic device using the wiring board. SOLUTION: A wiring layer 12 with an antenna circuit is formed on one surface of the first core material 11 composed of teflon as the first insulating material, the wiring layer 13 is formed on the other surface of the first core material 11, the wiring layer 15 and the wiring layer 16 are formed on both surfaces of the second core material 14 consisting of a glass-fiber epoxy resin in which a glass fiber as the second insulating material excepting teflon is impregnated with an epoxy resin, and the first core material 11 and the second core material 14 are bonded by a prepreg 17. COPYRIGHT: (C)2003,JPO |
