发明名称 MODULE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To increase the number of terminals in a module, and to reduce height. SOLUTION: In the module substrate having an external connection electrode formed on the outer-periphery surface of a multilayer laminate, at least one opening is provided on the module substrate, an end face electrode is formed on a sidewall at the opening, electric connection is made to the end face electrode, and a second external electrode is formed on the surface of the multilayer laminate, thus increasing the number of terminals in the module, and reducing height. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003218266(A) 申请公布日期 2003.07.31
申请号 JP20020013876 申请日期 2002.01.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OKADA EIJI;TSUNEOKA MICHIO;NISHIMURA DAISUKE
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
代理机构 代理人
主权项
地址