| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a three dimensional solenoid by employing a CMOS manufacturing technology and also by employing a back end treatment in which a photo masking is not employed. SOLUTION: In this method, two suspended arms, which are constructed each in double-layer metal structure made of metals having different remaining stresses or thermal expansion coefficients, are employed in such a manner that they are joined to an induction coil which is formed on an AlCu at a location between the two arms. After an insulating layer made of silicon dioxide is removed from the suspended arms, the induction coil rises up in a three dimensional structure from a semiconductor substrate surface. COPYRIGHT: (C)2003,JPO
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