| 发明名称 |
Chemical mechanical polishing slurry and method for using same |
| 摘要 |
An aqueous chemical mechanical polishing slurry useful for polishing the polysilicon layer of a semiconductor wafer comprising an aqueous solution of at least one abrasive, and at least one alcoholamine. The slurry preferably has a pH of from about 9.0 to about 10.5 and it includes an optional buffering agent.
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| 申请公布号 |
US2003143848(A1) |
申请公布日期 |
2003.07.31 |
| 申请号 |
US20030349987 |
申请日期 |
2003.01.23 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
STECKENRIDER J. SCOTT;MUELLER BRIAN L. |
| 分类号 |
B24B37/00;C09C1/68;C09G1/02;C09K3/14;H01L21/304;H01L21/321;(IPC1-7):C09G1/02;B24D3/02;C08H1/00;C09D1/00;C09G1/00;C09G1/04;H01L21/302;H01L21/461 |
主分类号 |
B24B37/00 |
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