| 摘要 |
<p>A vertical probe card for testing electronic devices includes a multi-layer ceramic substrate (32) mounted on a printed circuit board (31). The multi-layer ceramic substrate (32) provides a plurality of vertical probes (321) arranged in a planar array and formed on the surface of the multi-layer ceramic substrate (32) by micro-fabrication technology. The method of using the vertical probe card includes disposing a device to be tested under the card, aligning the card's probes (20) with the I/O terminals (22) of the device, and contacting the device with the card's ceramic substrate (32) so that all of the contact portions of the I/O terminals are contacted and deformed by the probes (321). The relative positions of the electronic device and the apparatus are maintained while Automatic Test Equipment tests the device.</p> |
