| 摘要 |
<p>A probe card on which micro probe needles are arranged at high density and with high precision with neither the need of a complicated structure nor the variation in needle height. A probe card (1) installed in a wafer tester comprises a board (2) having a wiring pattern for transmitting a test signal to be impressed on a wafer under test, a build-up board (10) formed on the surface of the board (2), a comb-shaped silicon-made probe needle (20) arranged on the build-up board (10) and connected to the surface wiring pattern (11), and a flat section (12) formed by plating on the surface wiring pattern (11) on the build-up board (10) and has a surface flattened by polishing. The probe needle (20) is loaded on the flat section (12) and thus mounted on the board (2).</p> |
