发明名称 LEAD FORMING EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To solve the problem that a burr is formed in a cut par when a tie bar connecting a part between leads is cut, and the bur is deformed or exfoliated and dropped in the case of lead-forming, so that a withstand voltage between leads is decreased or short circuit occurs. <P>SOLUTION: A recessed part 9d is formed in a part of a lead forming die 9 where a lead retaining surface 9a and a tie bar residual part 10 of a part 9b adjacent to the surface 9a correspond to each other. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003218307(A) 申请公布日期 2003.07.31
申请号 JP20020015133 申请日期 2002.01.24
申请人 NEC KANSAI LTD 发明人 FUKUYAMA RYOSUKE
分类号 H01L23/50 主分类号 H01L23/50
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