LEAD FRAME STRUCTURE OF INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a lead frame structure of an integrated circuit which reduces the occurrence of separation effectively and achieves a high efficiency green package.

SOLUTION: The lead frame structure 30 includes at least a chip holder 31 and a plurality of guiding lead strips 32 whose ends are concentrated to the chip holder 31. The chip holder 31 is connected with the lead frame structure 30 in a body using a connecting plate. A frame 34 which is connected with the connecting plate is disposed around the chip holder 31. An area of the chip holder 31 is smaller than that of a junction surface of the integrated circuit 40 being installed, and a size of the frame 34 is larger than that of the junction surface of the integrated circuit 40. Therefore an earthing wire 43 of the integrated circuit 40 can be welded with the frame 34.

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