| 摘要 |
<P>PROBLEM TO BE SOLVED: To simplify the process of connecting a semiconductor chip to the both ends of an antenna coil pattern. <P>SOLUTION: The semiconductor chip and the antenna coil pattern are disposed on a substrate, and one and the other bonding pads formed on the semiconductor chip are connected to the both ends of the antenna coil pattern by wire bonds, thereby, the operation of forming through holes in predetermined positions on the substrate is eliminated and the process of connecting the bonding pads to each end of the antenna coil pattern is simplified to reduce the cost of manufacturing a data carrier. <P>COPYRIGHT: (C)2003,JPO |
