发明名称 LEAD FRAME
摘要 <p><P>PROBLEM TO BE SOLVED: To solve the problem that a resin bur in the vicinity of a suspension pin exfoliates, drops and turns to a foreign matter when the pin is cut. <P>SOLUTION: A recessed part 17 is formed in the vicinity of a frame 8 side connecting part of the suspension pin 9 which connects a frame 8 with an island 2. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003218310(A) 申请公布日期 2003.07.31
申请号 JP20020014103 申请日期 2002.01.23
申请人 NEC KANSAI LTD 发明人 EGUCHI TAKAHIRO
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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