| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a constitution wherein a circuit side electrode is directly connected with an element side electrode and its junction is superior in durability. <P>SOLUTION: A semiconductor element is mounted on a circuit board 70. An emitter electrode (element side electrode) 22 is arranged on an upper surface of the semiconductor element 10. The circuit side electrode 30 is directly connected with the emitter electrode 22 by using solder 50. The whole part of the electrode 30 is in a mesh type. At least a part of the solder 50 permeates into the electrode 30, which has a lead-out part 34 continuously to the part connected with the electrode 22. A circuit pattern 74 is electrically connected with the emitter electrode 22 via the lead-out part 34. <P>COPYRIGHT: (C)2003,JPO</p> |
