| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that it is impossible to effectively radiate heat to be emitted by a semiconductor element in its operation in atmosphere. SOLUTION: This package for housing a semiconductor element comprises an insulating substrate 1 whose upper face has a recessed part 1a where a semiconductor element 3 is mounted and housed and a wiring conductor 6 derived from the recessed part 1a to the outer surface and a cover body 2, and the semiconductor element 3 is air-tightly housed inside the recessed part 1a of the insulating substrate 1. The insulating substrate 1 is formed with a plurality of through-metallic layers 8 put from the bottom face of the recessed part 1a to the lower face of the insulating substrate 1, the cross-sectional area of the through-metallic layer 8 is made gradually wider according as it goes from the bottom face of the recessed part 1a to the lower face of the insulating substrate 1, and the bottom face of the recessed part 1a is coated with a net- shaped metallic layer 9 linking the exposed edge parts of the through-metallic layers 8. COPYRIGHT: (C)2003,JPO |
