| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact surface-mounted electronic circuit unit that can obtain a high Q factor. SOLUTION: In the surface-mounted electronic circuit unit, an insulating board 1 has an inductance element 7 comprising a conductive pattern whose end section is connected to a second land section 3, a bare chip 8 is overlapped onto the insulating board 1, and first and second electrodes 9 and 10 connected to a first land section 2 and the second land section 3, respectively. As a result, the inductance element 7 is positioned on the lower surface of the bare chip 8, the length of a connection conductor between the inductance element and a semiconductor circuit can be extremely shorten, and the electronic circuit unit with a high Q factor can be provided especially at a high frequency. COPYRIGHT: (C)2003,JPO
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