发明名称 SURFACE ACOUSTIC WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a surface acoustic wave device which not only has a frequency temperature characteristic improved by forming an SiO<SB>2</SB>film on an IDT, but also has hardly a crack in the surface of the SiO<SB>2</SB>film, can securely obtain a desired characteristic, and has a large coefficient of electromechanical coupling and a small attenuation constantα. SOLUTION: The surface acoustic wave device has at least one IDT formed principally of Ag on an LiTaO<SB>3</SB>substrate of a 20-60°rotary Y plate and also has the SiO<SB>2</SB>film formed on the LiTaO<SB>3</SB>substrate while covering the IDT. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003218664(A) 申请公布日期 2003.07.31
申请号 JP20020010301 申请日期 2002.01.18
申请人 MURATA MFG CO LTD 发明人 KADOTA MICHIO
分类号 H01L41/09;H01L41/18;H03H3/08;H03H9/02;H03H9/145;H03H9/25;(IPC1-7):H03H9/145 主分类号 H01L41/09
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