ELECTRONIC COMPONENT WITH A PLASTIC HOUSING AND METHOD FOR PRODUCTION THEREOF

摘要

The invention relates to an electronic component, in which a semiconductor chip (3) is arranged, with a plastic housing (2) and method for production thereof. The lower side (6) of the plastic housing (2) comprises external contacts (7). The external contacts (7) are connected to contact surfaces (11) on the active upper side (12) of the semiconductor chip (3) by means of contact pegs (8) on the semiconductor chip (3) and by interconnecting lines (10) arranged on the plastic housing body (9). The contact pegs (8) thus represent an electrically-conducting projection of the contact surfaces (11).