| 摘要 |
<p>An ADSL transceiver chip is provided that includes an analog front-end and a digital signal processor (DSP) integrated on the same substrate. A line driver for the ADSL transceiver can be located on a separate substrate. In embodiments of the invention, the transceiver chip is implemented in a CMOS process. For example, the process could be a low voltage CMOS process. It is highly advantageous to build the analog front-end and the DSP on a single integrated IC because it allows for reduced manufacturing part count, reduced assembly time and cost. Furthermore, the line driver substrate can require a high voltage semiconductor process (e.g. 18 volts peak-to-peak) in some applications, because of the need or adequate voltage to drive the ADSL line. Whereas, the analog front-end and the DSP do not need the such a high-voltage process as required for the by the line (102). For example, the analog front-end and DSP can operate with 3.3 v or 5.0 v peak-to-peak. Therefore, the economies can be achieved by integrating the analog front-end and the DSP on the same substrate.</p> |
