发明名称 SOLDER ALLOY AND SOLDERED JOINT
摘要 <p>A solder alloy which does not exert adverse influences on the environment and has soldering properties equal to those of conventional Pb-Sn solder alloys; and a soldered joint made with the solder alloy. The solder alloy consists of 4.0 to 10.0 wt.% zinc, 1.0 to 15.0 wt.% indium, 0.0020 to 0.0100 wt.% aluminum, and tin and unavoidable impurities as the remainder. The soldered joint made with the solder alloy is useful in electrical/electronic appliances.</p>
申请公布号 WO2003061896(P1) 申请公布日期 2003.07.31
申请号 JP2002000390 申请日期 2002.01.21
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址