| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that stiffness becomes low in a semiconductor wafer that is applied to a frame body via an adhesive sheet when the semiconductor wafer is polished by a thickness of 100μm or less, the semiconductor wafer is damaged, when peeling from adhesive sheet, and additionally paste remains in the frame body, when the adhesive sheet is peeled from the frame body. <P>SOLUTION: The fixing method for a semiconductor wafer has a ring-shaped frame body 1 and an adhesive sheet 2 that is applied onto one surface of the frame body 1, and applies a semiconductor wafer 3 onto a surface, where the frame body 1 of the adhesive sheet 2 is not being applied for fixing. In this case, the adhesive sheet 2 has a support body 21 and an ultraviolet-curing adhesive layer 22, that is laminated on both the surfaces of the support body 21. <P>COPYRIGHT: (C)2003,JPO</p> |
