| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding apparatus that can grind and machine a thick substrate having a thickness of 50 to 200μm, obtained by grinding machining as well as a very thin substrate having a thickness of 25 to 50μm, obtained by the grinding machining. SOLUTION: In the grinding apparatus, a substrate 3 that is retained by a porous ceramic chuck 4 is rotated in the horizontal direction, and at the same time, a grinding liquid is supplied onto a substrate surface, and the substrate surface is ground by sliding a cup wheel type whetstone on the substrate surface so that a whetstone blade 55 of a cup wheel type whetstone 50 passes through the approximate center point of the substrate. The grinding apparatus has an internal grinding liquid supply mechanism 59, that supplies a grinding liquid from the inside of the peripheral wall of a whetstone substrate 101 toward the whetstone blade 55 of the cup wheel type whetstone as the supply mechanism of the grinding liquid, and an external grinding liquid supply mechanism, that supplies the grinding liquid from the outside of the peripheral wall of the whetstone substrate toward the whetstone blade of the cup wheel type whetstone by a grinding liquid supply nozzle 93 provided outside the chuck. When grinding a very thin substrate, the grinding liquid is supplied from the external grinding liquid supply mechanism 93. Conversely, in the grinding of a thick substrate, the grinding liquid is supplied by the internal grinding liquid supply mechanism 59. COPYRIGHT: (C)2003,JPO
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