发明名称 MULTI-PATTERN WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multi-pattern wiring board which can divide each wiring board region arranged and formed in a ceramic base substrate by aligning directivity. SOLUTION: In a multi-pattern wiring board, a plurality of wiring board regions 2 having a substantially quadrangle shape on an upper surface of which electronic parts 5 are mounted are arranged and formed in a central part of a substantially quadrangle flat-plate-like ceramic base substrate 1 in a vertical and lateral length sectioned by a division trench 4 formed on an upper surface and/or a lower surface of the ceramic base substrate 1. Further, a substantially quadrangle frame-like waste replaceable region 3 is formed so as to enclose a wiring board region 2 in an outer peripheral part of the ceramic base substrate 1. In an extension region of each length of the wring region 2 in the waste replaceable region 3, a recognition mark 8 for recognizing directivity of the wiring board regions 2 of each length is formed. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003218483(A) 申请公布日期 2003.07.31
申请号 JP20020015421 申请日期 2002.01.24
申请人 KYOCERA CORP 发明人 HASHIMOTO MAKOTO
分类号 H05K1/02;H05K3/00;(IPC1-7):H05K1/02 主分类号 H05K1/02
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