发明名称 RESIN COMPOSITION FOR FORMING ELECTRICALLY INSULATIVE THIN FILM, METHOD FOR FORMING THE ELECTRICALLY INSULATIVE THIN FILM, AND THE ELECTRICALLY INSULATIVE THIN FILM
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for forming an electrically insulative thin film by which a porous and low-dielectric-constant electrically insulative thin film can be formed, a method to efficiently from the porous and low- dielectric-constant electrically insulative thin film on the surface of an electric device, and the porous and low-dielectric-constant electrically insulative thin film. SOLUTION: This resin composition for forming an electrically insulative thin film comprises at least (A) an electrically insulative resin with high energy ray crosslinking property and thermal crosslinking property, (B) a high energy degradable resin, and (C) a solvent. This method is used to apply the composition onto the surface of an electronic device, allow the (C) element to be evaporated partially or entirely and form a film, give a high-energy ray thereto to crosslink the (A) element and decompose the (B) element, and to remove the decomposed substance by heating. Thus, an electrically insulative thin film is formed. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003218105(A) 申请公布日期 2003.07.31
申请号 JP20020293123 申请日期 2002.10.07
申请人 DOW CORNING TORAY SILICONE CO LTD 发明人 KOBAYASHI AKIHIKO;SAWA KIYOTAKA;NAKAMURA TAKASHI;MINE KATSUTOSHI
分类号 C08L23/20;C08L83/05;H01B3/44;H01L21/312;H01L21/316;H01L21/768;H01L23/522;(IPC1-7):H01L21/316 主分类号 C08L23/20
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