| 摘要 |
PROBLEM TO BE SOLVED: To prevent defect, in which a shape of adhesion unevenness is copied in a graphic, by a concise and low cost means if an adhesive applied to a reverse surface of a solid state image sensing element has its adhesion unevenness when the reverse surface of the solid state image sensing element formed on a semiconductor substrate is adhered to an element supporting surface of a package by using the adhesive such as silver paste. SOLUTION: The reverse surface opposite to an optical entrance surface of the solid state image sensing element 12 is polished to carry out a mirror finish, and a light reflective metal coat 13 is deposited on the reverse surface carrying out the mirror finish. A surface of the metal coat 13 and the element supporting surface 18 of the package 14 are adhered each other with the adhesive 24 to compose the solid state image sensing device 10. COPYRIGHT: (C)2003,JPO
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