发明名称 |
Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces |
摘要 |
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual contacts include a conductor and a cover. The conductor can comprise a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal section, and an inert exterior at least at the distal section. The cover comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.
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申请公布号 |
US2003141185(A1) |
申请公布日期 |
2003.07.31 |
申请号 |
US20010008636 |
申请日期 |
2001.12.05 |
申请人 |
WILSON GREGORY J.;PEDERSEN JOHN M.;EUDY STEVE L. |
发明人 |
WILSON GREGORY J.;PEDERSEN JOHN M.;EUDY STEVE L. |
分类号 |
A61K35/12;C25D5/08;C25D7/12;C25D17/06;C25F7/00;H01L21/288;(IPC1-7):C25C7/00;C25D17/00 |
主分类号 |
A61K35/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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