| 摘要 |
<p>A method of retaining a solder mass within a solder−bearing component is provided and includes the steps of:(a)forming a plurality of fingers in the solder−bearing component at one edge thereof,with each finger being defined by a pair of slots formed in the solder−bearing component;and(b)interleaving a solder mass between the fingers such that the solder mass is securely held by the fingers.The solder−bearing component includes any number of different types of components where a solder mass is held thereby,e.g.,leads,terminals,connectors,electromagnetic shields,etc.</p> |
