Automatic determination of melting point of solder profile involves exerting force on soldered component to be heated, determining component movement when melting point reached

摘要

The method involves exerting a force on a soldered component (1) that is to be heated and determining the movement of the component when the melting point is reached. The force is exerted laterally on a component soldered on to a circuit board (5) or similar using an electric motor with a pressure application part attached to its output shaft. AN Independent claim is also included for the following: an arrangement, especially for implementing the inventive method.