| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding device of an electronic component with a bump capable of realizing miniaturization in a horizontal direction, realizing uniform bonding in the bonding of the bump of the electronic component with the bump to an electrode formed on a substrate, and reducing damages to the electronic component, improving bonding strength and enabling highly reliable bonding. <P>SOLUTION: The bonding device is provided with a bonding tool having a vibration source capable of generating ultrasonic vibrations, an ultrasonic horn connected to the vibration source at one end and capable of propagating the vibration generated at the vibration source to the other end and a vibration imparting part connected to the other end of the ultrasonic horn and capable of imparting the vibration propagated by the ultrasonic horn to the electronic component. The electronic component is bonded to the electrode formed on the substrate by pressurizing it while imparting ultrasonic waves by the bonding tool and a part of the axial center of the ultrasonic horn is curved. <P>COPYRIGHT: (C)2003,JPO |
