| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method, a circuit board, and an electronic instrument wherein a bump is prevented from being destroyed widthwise, and a junction strength between a wiring and the bump is improved. <P>SOLUTION: There are mounted a semiconductor chip 10 on which a bump 14 is formed, and a board 20 on which the semiconductor chip 10 is mounted and which includes a wiring 30 with which the bump 14 is joined. The surface of the bump 14 and the surface of the wiring 30 are formed with the same metal, and the wiring 30 comprises a softer metal than nickel. <P>COPYRIGHT: (C)2003,JPO |
