发明名称 PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board in which a plating agent for forming a conductive body in an internal wall of an end surface through hole can enter sufficiently into the end surface through hole. SOLUTION: In a printed wiring board, an end surface through hole is formed on an end surface of a substrate forming a circuit pattern so as to perforate the end surface and one surface, respectively, and have a bottom to form a non-penetrating state in a thickness direction of the substrate. The closed-end hole is formed with a conductor electrically connected to the circuit pattern, and the closed-end hole is formed by either a sandblast processing or a photo-via method. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003218490(A) 申请公布日期 2003.07.31
申请号 JP20020016248 申请日期 2002.01.24
申请人 SHARP CORP 发明人 UENO YUKIHIRO;SHIMA KOJI
分类号 H05K1/11;H05K3/00;H05K3/40;H05K3/46;(IPC1-7):H05K1/11 主分类号 H05K1/11
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