| 摘要 |
PROBLEM TO BE SOLVED: To prevent separation of conductive paste filled in a viahall by increasing adhesion strength of conductive paste and the interior wall of the viahall. SOLUTION: Openings are formed for forming viahall 5 to a thermoplastic resin film 2 containing the air bubble 2a, and a concavity portion 6 is formed by exposing the air bubble 2a on the interior wall of the viahall 5. COPYRIGHT: (C)2003,JPO |
