发明名称 |
CIRCUIT STRUCTURE AND SEMICONDUCTOR INTEGRATED CIRCUIT |
摘要 |
PROBLEM TO BE SOLVED: To provide a circuit structure and a semiconductor integrated circuit by which bad influence by transient phenomenon is reduced when switching operation of a transistor becomes high-speed to the degree which receives a bad influence by transient phenomenon which arises at a power supply grounding line. SOLUTION: In this circuit, a bypass capacitor having a specified capacity is provided with at a power supply grounding line neighboring on a driver circuit in the chip, so that influence by transient phenomenon at the time of switching is reduced. The capacity of the bypass capacitor is set larger than the parasitic capacity of the driver circuit, so that the characteristic impedance of the power supply grounding line is made not larger than the characteristic impedance of the internal wiring. COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003218223(A) |
申请公布日期 |
2003.07.31 |
申请号 |
JP20020015753 |
申请日期 |
2002.01.24 |
申请人 |
OTSUKA KANJI;SUGA TADATOMO;USAMI TAMOTSU;NEC CORP;OKI ELECTRIC IND CO LTD;SANYO ELECTRIC CO LTD;SHARP CORP;SONY CORP;TOSHIBA CORP;HITACHI LTD;FUJITSU LTD;MATSUSHITA ELECTRIC IND CO LTD;MITSUBISHI ELECTRIC CORP;ROHM CO LTD |
发明人 |
OTSUKA KANJI;SUGA TADATOMO;USAMI TAMOTSU |
分类号 |
H01L21/822;H01L21/82;H01L23/522;H01L23/64;H01L27/04;H01L27/08;H03K19/00;H03K19/0175;(IPC1-7):H01L21/822;H03K19/017 |
主分类号 |
H01L21/822 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|