| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of an IC socket by making the IC socket conformable to IC packages differed in size, or plural kinds, substantially, not more than two kinds of IC package outer shape dimensions. SOLUTION: This IC socket comprises a base having an IC package mount part in the center, a socket body removably mountable with the base, a frame- shaped cover member provided vertically movably to the socket body, and a pressing mechanism for holding the IC packaged mounted on the IC package mount part. The base seat has a guide having an IC package receiving face formed higher. According to such a structure, the IC socket is conformable to plural kind of IC package outer dimensions. COPYRIGHT: (C)2003,JPO
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