| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package for preventing mold resin from being adhered to the lower face of a lead frame by making it difficult for mold resin to enter a clearance between a lead frame and a mold die. SOLUTION: In this method for manufacturing a semiconductor package by mounting a semiconductor device on a lead frame 20 having a main body 26 and a terminal 16, and molding the semiconductor device on one face of the lead frame so that the semiconductor device can be covered, the main body 26 and the terminal 16 are at least partially connected by a connecting part 34, and the connecting part 34 of the lead frame is cut by a laser after molding so that the main body 26 and the terminal 16 can be separated from each other. COPYRIGHT: (C)2003,JPO
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