发明名称 |
METHOD OF MANUFACTURING ELECTRONIC COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component with high productivity. <P>SOLUTION: This manufacturing method comprises a first process of forming a plurality of electronic elements 13 on a surface of a board 1, a second process of cutting a groove 9 in the surface of the board 1 along the peripheries of the electronic elements 13, and a third process of removing a part of the board 1 from the rear as far as the groove 9 so as to separate the electronic elements 13 from each other. <P>COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003218420(A) |
申请公布日期 |
2003.07.31 |
申请号 |
JP20020016553 |
申请日期 |
2002.01.25 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NAKATANI MASAYA;TAJIKA HIROBUMI;HAYASHI MICHIHIKO |
分类号 |
H01L41/22;G01C19/56;G01C19/5628;H01L41/08;H01L41/332 |
主分类号 |
H01L41/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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