发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component with high productivity. <P>SOLUTION: This manufacturing method comprises a first process of forming a plurality of electronic elements 13 on a surface of a board 1, a second process of cutting a groove 9 in the surface of the board 1 along the peripheries of the electronic elements 13, and a third process of removing a part of the board 1 from the rear as far as the groove 9 so as to separate the electronic elements 13 from each other. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003218420(A) 申请公布日期 2003.07.31
申请号 JP20020016553 申请日期 2002.01.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKATANI MASAYA;TAJIKA HIROBUMI;HAYASHI MICHIHIKO
分类号 H01L41/22;G01C19/56;G01C19/5628;H01L41/08;H01L41/332 主分类号 H01L41/22
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