| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonder for electronic parts and a bonding tool for electronic parts capable of utilizing vibrations efficiently without causing damage to the electronic parts. <P>SOLUTION: In a bonding tool bonding electronic parts by ultrasonic vibrations, a projected part 30 that is projected downward is provided at the central position of ribs 15c of a horn 15 that is lifted and supported by the two ribs 15c with a piezoelectric transducer 17 fitted at the end part, and the projected end of the projected part 30 is made to be a bonding function part 31 contacting the electronic parts. The piezoelectric transducer 17 is driven to impart longitudinal vibrations to the horn 15, and thereby the phase of stretching vibration in the vertical direction of the horn 15 generated due to this longitudinal vibration is brought to the same phase as the phase of bending vibration generated at the projected part 30. Then, the displacement of stretching vibration at the side end parts A and B of the bonding function part 31 is offset by the flexural displacement due to the bending vibration. <P>COPYRIGHT: (C)2003,JPO</p> |
