| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic circuit device for an automobile which reduces the occurrence of thermal stress molding resin cracking or the thermal stress separation of a molding resin from an electronic circuit board or its lead frame (base) by resin-molding the electronic circuit board and the base with the molding resin into a package. <P>SOLUTION: The electronic circuit device comprises an electronic circuit composed of the electronic circuit board which has installed electronic parts, the base to which the electronic circuit is adhered, a flange which is disposed on a partial area of the base, and leads whose materials are different from those of the base, and wherein the electronic circuit is connected electrically to the leads. The leads, the electronic circuit board excluding its partial area for the flange and the flange are molded in a body by resin-molding. The base is made of Invar clad with copper on both sides, and the leads are made of copper or a copper alloy. <P>COPYRIGHT: (C)2003,JPO</p> |
