| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board that can substantially suppress the of failures when forming a circuit, can be improved in the manufacturing yield, and is provided with lands on which many electrodes are formed in a grid and which is used for mounting electronic parts. SOLUTION: A wiring circuit is partially or wholly led out through a cross- shaped vacant space formed in the land forming area of a lower wiring layer by leading out via lands and blind via holes by means of sub-lands. COPYRIGHT: (C)2003,JPO |
