发明名称 SEALING BOARD, MANUFACTURING METHOD FOR IT, DISPLAY DEVICE AND ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To reduce the weight of a sealing board without shortage of strength and any increase in quantity of transmitting moisture and oxygen. <P>SOLUTION: This sealing board has a first and second boards 10, 20. A recess 12 is formed on a first face of the first board 10. The first board 10 has a plate part 14 forming the base of the recess 12 and a frame part 16 forming the inner wall surface of the recess 12. The second board 20 is fitted to the second face of the first board 10. The second board 20 is formed of a material having a smaller specific gravity than the first board 10. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003217827(A) 申请公布日期 2003.07.31
申请号 JP20020012884 申请日期 2002.01.22
申请人 SEIKO EPSON CORP 发明人 HAYASHI KENJI
分类号 H01L23/02;H01L51/50;H01L51/52;H05B33/04 主分类号 H01L23/02
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