| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image pickup device in which bond strength between a lens holder and a substrate can be improved by expanding a bonding area between the lens holder and the substrate. SOLUTION: An end face 33f of a cylindrical part 33e of the lens holder are provided with a plurality of recesses 33g over the entire circumference of the end face, and an adhesive 36 is filled in the respective recesses 33g. A plurality of fine irregularities are formed on the surfaces of the end face 33f and the recesses 33g, so as to form a rugged surface, and an adhesive 36 is filled in the recess of each of the irregularities. Then, the bonding area between the lens holder and the substrate 1 is expanded by the recesses of the irregularities of the recesses 33g and their surfaces so that the bond strength of the lens holder and the substrate 1 can be improved. COPYRIGHT: (C)2003,JPO
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