| 摘要 |
<P>PROBLEM TO BE SOLVED: To surely print the jointing materials of a circuit element on a substrate when the print area of the jointing materials is reduced. <P>SOLUTION: In this semiconductor device, a semiconductor chip 12 is disposed in a cavity 14a arranged on a multi-layer substrate 14, a semiconductor chip 12 is coated by potting materials 26 having a rising member 26a whose height h1 from the surface of the multi-layer substrate 14 exceeds the thickness of a wiring layer 20 (land 20a) disposed on the surface of the multi-layer board 14, and a chip component 22 is jointed to the wiring layer 20 on the surface of the multi-layer substrate 14 by using low melting point solder 24 disposed by the printing of cream solder. <P>COPYRIGHT: (C)2003,JPO |
