发明名称 HEAT RADIATING STRUCTURE FOR ELECTRICAL JUNCTION BOX, HEAT RADIATING DEVICE THEREOF, AND HEAT RADIATING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat radiating structure of an electrical junction box, a heat radiating device thereof, and a heat radiating method thereof, capable of restraining increase in the temperature of the electrical junction box assembled onto a reinforcement of a vehicle or the like. <P>SOLUTION: This electrical junction box comprises a reinforcement 63, a case 13 assembled onto the reinforcement 63, semiconductor switches 41<SB>3</SB>, 42<SB>3</SB>, 43<SB>3</SB>, 44<SB>3</SB>attached to the case 13. Radiating plates 41a<SB>3</SB>, 42a<SB>3</SB>, 43a<SB>3</SB>, 44a<SB>3</SB>, which release the heat generated at the bodies of the semiconductor switches 41<SB>3</SB>, 42<SB>3</SB>, 43<SB>3</SB>, 44<SB>3</SB>, are formed on the semiconductor switches 41<SB>3</SB>, 42<SB>3</SB>, 43<SB>3</SB>, 44<SB>3</SB>in a protruding manner, the semiconductor switches 41<SB>3</SB>, 42<SB>3</SB>, 43<SB>3</SB>, 44<SB>3</SB>are set adjacent to the reinforcement 63, and the fluid kept at a temperature lower than those of the semiconductor switches 41<SB>3</SB>, 42<SB>3</SB>, 43<SB>3</SB>, 44<SB>3</SB>is introduced into the reinforcement 63. Thus, the temperatures of the semiconductor switches can be maintained so as to be low. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003219537(A) 申请公布日期 2003.07.31
申请号 JP20020012744 申请日期 2002.01.22
申请人 YAZAKI CORP;TOYOTA MOTOR CORP;DENSO CORP;KOJIMA PRESS CO LTD;TAIHEIYO SEIKO KK 发明人 TAKEUCHI KUNIHIKO;EGAWA MASATOSHI;MORI TOSHIAKI;SHIMAZU HIROICHI;YASUMA MITSURU;SHIBATA ICHIRO;IKEDA KOJI;TANAKA TAKASHI;YONEYA SEIJI;OTA MANABU;IWATA ATSUSHI;SHIBATA HIDEKI
分类号 B60R16/02;H02G3/08 主分类号 B60R16/02
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