| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device and a mounting method, which are capable of decreasing the number of cameras, shortening a tact time as a whole, and improving production efficiency. <P>SOLUTION: An electronic component mounting device is equipped with a bond applying means 20 which applies a bond 24 in spots on the top surface of a board 11 where a plurality of chips P are mounted on a bond applying stage A, a chip mounting means 30 which mounts the chips P on the applied bonds 24 on a chip mounting stage/observing stage B provided down the bond applying stage A, and a camera 50 which is provided on the chip mounting stage/observing stage B to serve as a board observing means. Three objects, the chip P mounted on the applied bond 24, the applied bond where no chip is mounted, and a board position recognition mark, are observed with the camera 50. The position of the board is recognized, and it is judged by a control unit 70 on the basis of these three observation data whether the mounting conditions of the chip P and the conditions of the applied bond are good or not. <P>COPYRIGHT: (C)2003,JPO |
