METHOD FOR MANUFACTURING ELECTRONIC UNIT CASING

摘要

PROBLEM TO BE SOLVED: To cool a casing even if a CPU or a memory whose calorific value is high is mounted in the narrow space of a small electronic unit and to thin a notebook computer while sufficient strength is maintained.

SOLUTION: Heat caused from an element is transmitted to the surface of the casing through a heat pipe channel 3 formed in the casing and it is radiated from the wide face of the casing. The rugged structure of the heat pipe channel 3 improves the rigidity of the plate.

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