Building component with constant distorsion-free bonding, and method for bonding

摘要

For gluing stress-sensitive component substrates (BS) having a system carrier (ST), it is proposed to provide spacing structures (AS) between the two surfaces to be glued, the structures assuring a defined arrangement of the two surfaces to be glued. The spacing structures can be created through a screening process, and the space between the spacing structures can be filled with glue (K).