Heat dissipating device for an electronic component

摘要

A heat dissipating device includes a lower heat sink unit and an upper heat sink unit stacked above the lower heat sink unit. The lower heat sink unit includes a base and a plurality of parallel fins extending from the base. Each of the fins has a top end distal from the base. The fins include a set of first fins and a set of second fins. Each of the first fins has a horizontal cross-section greater than that of each of the second fins. Each two adjacent ones of the first fins confine a horizontal spacing greater than that of each two adjacent ones of the second fins.