| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To allow evaluating each circuit component of a module even after the module is assembled and evaluating also an entire module which is surface- mounted on a substrate. <P>SOLUTION: There is provided a module that comprises a module substrate and a plurality of circuit components which is formed on the module thereof to be mutually insulated and each has an independent feature, and implements a predetermined feature by an operation of each circuit component, wherein each of the plurality of circuit components is provided with mutually insulated terminals on the surface of the module substrate. Furthermore, there is provided a surface-mounted module that has a connection wiring for electrically connecting at least two terminals on the surface of the module, further comprises a base substrate for supplying the module with power, causes each circuit component connected via the connection wiring to operate based on the power supplied from the base substrate, and implements a predetermined feature. <P>COPYRIGHT: (C)2003,JPO</p> |
