| 摘要 |
PROBLEM TO BE SOLVED: To downsize various electronic device each configured with a quartz module. SOLUTION: A container part 5 for containing a quartz chip 50 is formed to a ceramic multilayer board 2. The quartz chip 50 is connected to lead electrodes 16, 16 formed on an insulation layer 12 in the container part 5 and a cover 6 is joined with a joining face 18 formed to an upper edge of the container part 5 to air-tightly sealing inside of the container part 5 thereby forming a quartz vibrator in a quartz module board 2. Thus, it is not required to mount the quartz vibrator on the front side of the quartz module board 2 to downsize the quartz module board 2. COPYRIGHT: (C)2003,JPO
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